Parametric cost estimating: a practical independent method of estimating the manufacturing cost of chips to modules in the Peoples Republic of China

R. Farrington
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Abstract

The cost estimating discipline is making rapid progress in the Peoples Republic of China. Parametric cost estimating tools, including a microcircuit parametric estimating model, have been introduced to the major large system developers in China. The parametric cost estimating process not only estimates product cost but also provides an effective program cost management tool used for design to cost trade studies. This paper introduces the parametric cost estimating method and explores the parametric process when applied to an advanced microcircuit packaging (LTCC) in a high volume, relatively low cost application used in a rugged environment. The PRICE Systems Microcircuit (PRICE M) parametric cost estimating model is presented along with its fundamental cost drivers and factors. An independent parametric estimate for a low temperature cofired ceramic (LTCC) microcircuit module is presented. The required estimating parameters and the resulting estimate is described along with a technical walk-thru using the independent parametric estimate of the 24 GHz short range radar sensor for automotive applications. The independent cost analysis estimate is based upon a microcircuit developed in a joint project of IMST GmbH (Germany) with DuPont Microcircuit Materials (a detailed presentation of the microcircuit project is described in the IMAPS Advancing Microelectronics March/April 2005 publication). The packaged chips and all components along with the LTCC substrate cost and assembly and test costs of the assembled module is estimated and presented. The entire estimate uses P.R. China financial factors.
参数成本估算:一种估算中国芯片到模块制造成本的实用独立方法
成本估算学科在中华人民共和国发展迅速。参数化成本估算工具,包括微电路参数化成本估算模型,已经被介绍给国内主要的大型系统开发商。参数化成本估算过程不仅对产品成本进行估算,而且为设计成本贸易研究提供了有效的项目成本管理工具。本文介绍了参数化成本估算方法,并探讨了在恶劣环境中大批量、相对低成本应用的先进微电路封装(LTCC)的参数化过程。提出了PRICE系统微电路(PRICE M)参数化成本估算模型及其基本成本驱动因素。提出了低温共烧陶瓷(LTCC)微电路模块的独立参数估计方法。描述了所需的估计参数和结果估计,并使用汽车应用的24 GHz短距离雷达传感器的独立参数估计进行了技术演示。独立的成本分析估计是基于IMST有限公司(德国)与杜邦微电路材料公司联合项目开发的微电路(微电路项目的详细介绍在IMAPS推进微电子2005年3月/ 4月出版物中进行了描述)。对封装的芯片和所有组件以及LTCC基板成本以及组装模块的组装和测试成本进行了估计和介绍。整个估算使用了中国的财务因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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