Effect of Volume on Ceramic Ball-Grid Array Solder Life

Abstract

Paper describes the effect of solder volume on solder life based on linear finite element analysis using ANSYS. The results indicate an optimal volume for the solder life. Any increase or decrease in the solder volume from the optimum volume decreases the fatigue life of solder joints. Solder joint life was also experimentally determined for the same temperature excursion with a 2-hour thermal cycle. The experimental results compare well with the results estimated by finite element modeling. Studies for one elastic-plastic analysis has also been carried out. Initial results indicate substantial increase in strain concentration factor.