T. Bieniek, G. Janczyk, M. Ekwinska, T. Budzynski, P. Gluszko, P. Grabiec, A. Kociubiński
{"title":"Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example","authors":"T. Bieniek, G. Janczyk, M. Ekwinska, T. Budzynski, P. Gluszko, P. Grabiec, A. Kociubiński","doi":"10.1109/3DIC.2014.7152184","DOIUrl":null,"url":null,"abstract":"The fundamental principle of complex systems development consists in integration of a range of design activities related to a set technological processes into the advanced, multistage, time consuming product development chain. The most representative sample smart system includes at least micro-electro-mechanical module (MEMS) assisted by the dedicated readout circuitry (IC) supporting specific signal conversion and data processing capabilities. Communication modules can be integrated in the IC or belong to particular application environment scheme.","PeriodicalId":231905,"journal":{"name":"2014 International 3D Systems Integration Conference (3DIC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC.2014.7152184","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The fundamental principle of complex systems development consists in integration of a range of design activities related to a set technological processes into the advanced, multistage, time consuming product development chain. The most representative sample smart system includes at least micro-electro-mechanical module (MEMS) assisted by the dedicated readout circuitry (IC) supporting specific signal conversion and data processing capabilities. Communication modules can be integrated in the IC or belong to particular application environment scheme.