Alternative dicing die attach film method for high volume small dice application

Abstract

This paper introduces an unconventional sawing approach for sawing die attach film (DAF) to successfully re-solve severe loose dies and severe dies non-pick issues at die attach (DA) process particularly small dice application. Conventional forward step cut during DAF sawing causes the DAF layer to penetrate and anchor into the base/dicing film. A diverse wafer sawing approach and study on DAF was carried out by evaluating different sawing method and sawing parameters. The results show that for small dice DAF sawing, a modified step reverse cut mode is crucial to ensure good and high die attach pick up yield. An innovative reverse step cut sawing method is proposed for sawing small dice application with DAF.