Reducing the cost of package Test

Abstract

It is no secret that semiconductor manufacturers in today's marketplace face intense pressure to reduce cost while improving quality. However, package test remains an area that is often overlooked in cost-saving initiatives. In this session, you will learn about the elements that make up the total cost of packaging test and discover new ways to reduce costs, such as design for testability. The session will also describe how to optimize use of automatic test equipment (ATE) and determine the most effective test site strategy.