Semiconductor packaging for the telecommunications industry

Abstract

This overview paper outlines the areas of future semiconductor packaging challenge for the dynamic telecommunications industry. The declining cost of both bandwidth and digital computing coupled with deregulation and the opening of global markets has created a wealth of business opportunities for new and established competitors. All network sectors are searching for methods to increase performance, reliability and functional density while cost reducing the manufacturing process. Achieving this goal requires innovation in system architecture and software, semiconductors, optoelectronics and interconnect technologies. This paper focuses on the link between future network trends and the semiconductor packaging technology needed to serve the future telecom industry.