Effect of Ag addition on the intermetallic compound and joint strength between Sn-Zn-Bi lead free solder and copper substrate

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521777

N. A. Jasli, H. A. Hamid, R. Mayappan

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Abstract

This study investigated the effect of Ag addition on the formation of intermetallic compounds and joint strength of the Sn-Zn-Bi based alloys under liquid state aging. The intermetallic compounds were formed by reacting Sn-8Zn-3Bi and (Sn-8Zn-3Bi)-1Ag lead free solders on copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. It was found that for Sn-8Zn-3Bi solder reacting with Cu substrate, the Cu₅Zn₈ intermetallic was formed. On the other hand, when 1% Ag was added into the solder, the Cu₃Sn and Cu₆Sn₅ IMC were formed. The morphology of the Cu₅Zn₈ intermetallic was flat whereas for Cu₃Sn and Cu₆Sn₅ were rather scallop. The addition of Ag into the Sn-Zn-Bi solder increases the shear strength of the solder joint. It is believed the scallop morphology of Cu-Sn contribute to strengthening the (Sn-8Zn-3Bi)-1Ag/Cu joints.

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Ag对Sn-Zn-Bi无铅钎料与铜基体金属间化合物及连接强度的影响

研究了Ag对液态时效下Sn-Zn-Bi基合金金属间化合物形成及接头强度的影响。Sn-8Zn-3Bi和(Sn-8Zn-3Bi)-1Ag无铅钎料在铜基体上反应生成金属间化合物。用扫描电镜(SEM)观察了相的形貌，并用能量色散x射线(EDX)估计了相的元素组成。结果表明，Sn-8Zn-3Bi钎料与Cu衬底反应形成Cu5Zn8金属间化合物。另一方面，当钎料中添加1%的Ag时，形成Cu3Sn和Cu6Sn5 IMC。Cu5Zn8金属间化合物的形貌呈扁平状，而Cu3Sn和Cu6Sn5则呈扇形。在Sn-Zn-Bi钎料中添加Ag可以提高焊点的剪切强度。认为Cu- sn的扇形形态有助于(Sn-8Zn-3Bi)-1Ag/Cu接头的强化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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