Membrane probe technology for MCM Known-Good-Die

Abstract

A new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good-Die (KGD) solution for Multichip Module (MCM) manufacture is described. The membrane consists of TAB tape mounted with an array of several thousands micro-bumps. The bumps are connected in a radial pattern and the pitch of the bumps is equal to the pitch of the I/O pads in LSIs. The advantage of this new membrane is that a single wiring pattern is applicable to many die designs without the need for customizing. In this paper, two KGD applications of the new membrane are investigated, one is a wafer probe and the other a burn-in socket.