E. Kuah, J. Hao, W. Chan, Wu Kai, C. Ashokkumar, S. Ho, L. Christie, John Macleod
{"title":"Large format packaging — An alternative format for discrete packaging: Its challenges and solutions","authors":"E. Kuah, J. Hao, W. Chan, Wu Kai, C. Ashokkumar, S. Ho, L. Christie, John Macleod","doi":"10.1109/EPTC.2016.7861513","DOIUrl":null,"url":null,"abstract":"This paper will review the challenges on large format encapsulation with respect to mold cap thickness control, encapsulant impact on moldability such as flow mark and flow mark on final product. Control of mold co-planarity is best performed dynamically during molding, otherwise it would be challenging to obtain good co-planarity within ± 20 μm. Moldability demand such encapsulant coverage with highly viscous material, flow-ability and flow mark are discussed. Warpage control heavily depends on the formulation of the encapsulant and the form of encapsulant, i.e., granular, liquid and sheet.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861513","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper will review the challenges on large format encapsulation with respect to mold cap thickness control, encapsulant impact on moldability such as flow mark and flow mark on final product. Control of mold co-planarity is best performed dynamically during molding, otherwise it would be challenging to obtain good co-planarity within ± 20 μm. Moldability demand such encapsulant coverage with highly viscous material, flow-ability and flow mark are discussed. Warpage control heavily depends on the formulation of the encapsulant and the form of encapsulant, i.e., granular, liquid and sheet.