Scaling trends in DRAM technology

G. Bronner
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引用次数: 1

Abstract

Summary form only given. Trends in scaling DRAM to 0.11 /spl mu/m and below are reviewed. Scaling techniques used in earlier generations for the array access transistor and the storage capacitor are running into limitations, necessitating changes in electrical operating mode, cell structure, and processing innovations. Although a variety of options exist for advancing the technology, including low-voltage operation, non-planar array transistor MOSFETs, and novel capacitor structures and materials, uncertainties exist over the which of these will prove workable in manufacturing. This paper discusses the interrelationships among the DRAM scaling requirements and solutions.
DRAM技术的扩展趋势
只提供摘要形式。回顾了将DRAM扩展到0.11 /spl mu/m及以下的趋势。前几代用于阵列接入晶体管和存储电容器的缩放技术正面临局限性,需要改变电气操作模式、电池结构和工艺创新。虽然有各种各样的选择来推进这项技术,包括低压操作,非平面阵列晶体管mosfet,以及新型电容器结构和材料,但其中哪一种在制造中是可行的存在不确定性。本文讨论了DRAM扩展需求和解决方案之间的相互关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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