Anodic Bonding a Low Temperature Bonding Method for Processed MEMS and CMOS Wafers

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598393

R. Knechtel, H. Mehner, T. Berthold, C. Van Buggenhout, Dirk Terryn

引用次数: 0

Abstract

Anodic bonding is in general a very attractive low temperature bonding method. Utilizing the progress in glass structuring and with adapted bonding conditions it can be used for CMOS-MEMS integrated wafers enabaling very complex, multifunctional chip solutions.

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阳极键合:加工MEMS和CMOS晶圆的低温键合方法

阳极键合通常是一种非常有吸引力的低温键合方法。利用玻璃结构的进步和适应的键合条件，它可以用于CMOS-MEMS集成晶圆，实现非常复杂的多功能芯片解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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