{"title":"A study on statistical process control technology applied in reflow soldering processes","authors":"Wu Zhao-hua","doi":"10.1109/ICEPT.2005.1564739","DOIUrl":null,"url":null,"abstract":"SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564739","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.