Computer-Aided Thermal Anlaysis of a Hybrid Mutlistage Active Bandpass Filter/Amplifier

Abstract

This paper describes the thermal analysis of a hybrid microcircuit to be used as a signal amplifier and conditioner for an IR tracking system. The details of circuit fabrication and an analysis of the electrical and noise performance of the circuit have been presented in a previous paper [1]. It is the purpose of this paper to describe the use of computeraided analysis to determine the thermal performance of the circuit and to present a computer-aided approach to the thermal design of hybrid microelectronic circuits. Thermal analysis and measurements are made, revealing the temperature distribution and power-dissipating capability. These results also provide design guidelines for the layout of heat-dissipating devices such as amplifier chips. Package convection and radiation as well as internal heat conduction are modeled using node point analysis. Temperature measurements provide verification of the thermal models.