{"title":"Logic circuit analysis and TEM inspection of IDDQ logic leakage","authors":"Ang Chung Keow, Yong Foo Khong","doi":"10.1109/IPFA.2016.7564279","DOIUrl":null,"url":null,"abstract":"The decreasing of technology node has made process of failure analysis become difficult. This paper outlines electrical fault localization method on IDDQ logic leakage failure. Upon fault localization, a complete analysis through TEM was performed for identification and further understanding of the failure mechanism eventually led to root cause finding.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564279","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The decreasing of technology node has made process of failure analysis become difficult. This paper outlines electrical fault localization method on IDDQ logic leakage failure. Upon fault localization, a complete analysis through TEM was performed for identification and further understanding of the failure mechanism eventually led to root cause finding.