A double-polysilicon self-aligned npn bipolar process (ADRF) with optional NMOS transistors for RF and microwave applications

K. O, P. Garone, C. Tsai, B. Scharf, M. Higgins, D. Mai, C. Kermarrec, J. Yasaitis
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引用次数: 22

Abstract

A silicon bipolar process for RF and microwave applications, which features 25-GHz double-polysilicon self-aligned npn bipolar transistors with 5.5-V BV/sub CEO/, optional 0.7-/spl mu/m NMOS transistors with p/sup +/ polysilicon gate for switch applications, lateral pnp transistors, high and low valued resistors, and p/sup +/ polysilicon-to-n/sup +/ plug capacitors, is described. The npn transistors utilize nitride-oxide composite spacers formed using sacrificial TEOS spacers. The RF and microwave capabilities of the process up to several GHz are demonstrated by fabricating and characterizing RF amplifiers, low noise amplifiers, and RF switches.
一种双多晶硅自对准npn双极工艺(ADRF),可选用于射频和微波应用的NMOS晶体管
描述了一种用于射频和微波应用的硅双极工艺,其特点是具有5.5 v BV/sub CEO/的25 ghz双多晶硅自校准npn双极晶体管,可选的0.7-/spl mu/m NMOS晶体管具有用于开关应用的p/sup +/多晶硅栅极,侧向pnp晶体管,高值和低值电阻器以及p/sup +/多晶硅对n/sup +/插头电容器。npn晶体管利用牺牲TEOS衬垫形成的氮氧化物复合衬垫。通过制造和表征射频放大器、低噪声放大器和射频开关,证明了该工艺高达几GHz的射频和微波能力。
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