Towards reliability and performance-aware Wireless Network-on-Chip design

2015 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS) Pub Date : 1900-01-01 DOI:10.1109/DFT.2015.7315163

Michael Opoku Agyeman, K. Tong, T. Mak

{"title":"Towards reliability and performance-aware Wireless Network-on-Chip design","authors":"Michael Opoku Agyeman, K. Tong, T. Mak","doi":"10.1109/DFT.2015.7315163","DOIUrl":null,"url":null,"abstract":"Recently Hybrid Wired-Wireless Network-on-Chip (WiNoC) has emerged to solve the poor scalability and performance issues of modern System-on-Chip (SoC) design. However, conventional on-chip wireless interconnect has a high error rates which have drastic effects on the total reliability of the WiNoC. In this paper, we propose an improved wireless interconnect fabric that is able to achieve a similar error rate as traditional wireline channels as an effort to improve the overall reliability of WiNoCs. A novel transducer is designed to launch surface wave signals into a commercially available thin metal conductor coated with a low cost dielectric material to generate wireless signals with high signal strength. Experimental results show that, for a 60GHz center frequency, the proposed communication fabric can achieve an operational bandwidth of about 60GHz. Compared to existing WiNoCs, the proposed communication fabric can improve the reliability of WiNoCs with average gains of 21.4%, 13.8% and 10.7% performance efficiencies in terms of maximum sustainable load, throughput and delay, respectively.","PeriodicalId":383972,"journal":{"name":"2015 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS)","volume":"2 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFT.2015.7315163","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

Abstract

Recently Hybrid Wired-Wireless Network-on-Chip (WiNoC) has emerged to solve the poor scalability and performance issues of modern System-on-Chip (SoC) design. However, conventional on-chip wireless interconnect has a high error rates which have drastic effects on the total reliability of the WiNoC. In this paper, we propose an improved wireless interconnect fabric that is able to achieve a similar error rate as traditional wireline channels as an effort to improve the overall reliability of WiNoCs. A novel transducer is designed to launch surface wave signals into a commercially available thin metal conductor coated with a low cost dielectric material to generate wireless signals with high signal strength. Experimental results show that, for a 60GHz center frequency, the proposed communication fabric can achieve an operational bandwidth of about 60GHz. Compared to existing WiNoCs, the proposed communication fabric can improve the reliability of WiNoCs with average gains of 21.4%, 13.8% and 10.7% performance efficiencies in terms of maximum sustainable load, throughput and delay, respectively.

查看原文本刊更多论文

面向可靠性和性能敏感的无线片上网络设计

近年来，为了解决现代片上系统(SoC)设计的可扩展性差和性能问题，出现了混合有线-无线片上网络(WiNoC)。然而，传统的片上无线互连具有很高的错误率，这对WiNoC的总可靠性有很大的影响。在本文中，我们提出了一种改进的无线互连结构，能够实现与传统有线信道相似的错误率，以提高winoc的整体可靠性。设计了一种新型换能器，将表面波信号发射到涂有低成本介电材料的商用薄金属导体中，以产生具有高信号强度的无线信号。实验结果表明，在中心频率为60GHz的情况下，所提出的通信结构可实现约60GHz的工作带宽。与现有的winoc相比，所提出的通信结构可以提高winoc的可靠性，在最大可持续负载、吞吐量和延迟方面的平均性能效率分别提高21.4%、13.8%和10.7%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2015 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS)

自引率

0.00%

发文量