Mechanical properties and adhesion measurements of films used in advanced packages

Abstract

"Depth-sensing" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three different techniques can be employed to determine these mechanical properties. The first part of this paper describes each technique. The second part of this paper presents two applications that employ these techniques to measure the properties of various materials used in advanced integrated circuit packages, including polyimide die coat modulus and adhesion, and SnPb solder plate hardness.<>