Yang Zhang, Hanju Oh, Yue Zhang, Li Zheng, G. May, Muhannad S. Bakir
{"title":"Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs","authors":"Yang Zhang, Hanju Oh, Yue Zhang, Li Zheng, G. May, Muhannad S. Bakir","doi":"10.1002/9783527697052.CH16","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"4 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Handbook of 3D Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527697052.CH16","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}