Nano-indentation test across the sintered silver/ copper interface

Abstract

In this paper, the nano-indentation test results for the sintered silver layer along the interface of sintered silver/ copper are studied. The elastic modulus in the microscopic performance was measured by the nano-indentation experiment, and the tested results are presented with various indentation location across the sintered silver/copper interface. The experimental sample was prepared by controlling the same sintering process with die attach in the power electronic module. The measured results of the nano-indentation test are about 27.4GPa, 16.9GPa, and 8.8GPa, where the solutions depend on the tested location and the microstructure distribution. Through the investigation, it can be found that the result of measuring the elastic modulus of sintered silver strongly depends on the porosity of the sample and the test location on the sample. Unified and standard test methods for evaluation mechanical behaviors of the sintered silver layer need to be developed for academic and industrial aims in further work.