Wu Chunlei, M. Motohiko, Winter Wang, G. Song, Wu Miao, T. Li, Yung-II Joe
{"title":"Resistive vias defect localization methodology in failure analysis","authors":"Wu Chunlei, M. Motohiko, Winter Wang, G. Song, Wu Miao, T. Li, Yung-II Joe","doi":"10.1109/IPFA.2011.5992711","DOIUrl":null,"url":null,"abstract":"Generally, it is very difficult to locating a resistive via defect in function failure analysis in CMOS circuit. This type defect could not be located directly by Photon emission microscopy analysis or other failure analysis techniques. In this paper, a useful method is introduced to show how to locate a resistive via defect. Some cases are presented in detail. And some valuable experiences are shared which could help us locate a resistive via defect quickly.","PeriodicalId":312315,"journal":{"name":"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"113 12","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2011.5992711","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Generally, it is very difficult to locating a resistive via defect in function failure analysis in CMOS circuit. This type defect could not be located directly by Photon emission microscopy analysis or other failure analysis techniques. In this paper, a useful method is introduced to show how to locate a resistive via defect. Some cases are presented in detail. And some valuable experiences are shared which could help us locate a resistive via defect quickly.