Modeling and Analysis of Differential Crosstalk of Interconnect Structures in High-Density Packages

Abstract

Aiming at the problem of large analysis error of the traditional model, the modeling and analysis of differential signal crosstalk of interconnect structure in high-density packages is proposed. Based on the analysis of the coupling relationship of the differential transmission line of interconnect structure, a four-wire differential structure crosstalk model is created; This model conducts equivalent analysis of the resistance, capacitance and inductance in the differential crosstalk of the interconnect structure, and solves the problem of differential crosstalk of the interconnect structure in the high-density packages. Experiments have proved that the average error of the model established is 0.042 this time, which satisfies the suppression of high-density packages accuracy requirements for differential crosstalk of the interconnect structures.