Low temperature Au-Au direct bonding with highly <111>-oriented Au films

Abstract

In this study, a bonding process with highly <111> oriented nano-twined Au (nt-Au) was proposed. A less void bonding interface was observed and it reveals a good bonding quality for the bonded samples. In addition, the Au grains can grow across original interface. All of the above make we suggest Au-Au direct bonding have high strength and durable bonding structure.