Room temperature bonding of wafers in air using Au-Ag alloy films

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886167

H. Kon, M. Uomoto, T. Shimatsu

引用次数: 1

Abstract

Room temperature bonding of wafers in air using Au-Ag alloy films was studied. Experimental results show that the bonding using Au-Ag alloy films containing Ag content up to 70-80 at% shows almost equal bonding performance in air to that obtained using Au films.

查看原文本刊更多论文

利用金-银合金薄膜在空气中进行室温键合

研究了用金-银合金薄膜在空气中的室温键合。实验结果表明，在空气中，用含银70 ~ 80% (at%)的Au-Ag合金薄膜进行键合，其键合性能与用Au薄膜的键合性能几乎相同。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

自引率

0.00%

发文量