The probability design for wire bonding process by finite element and Monte Carlo method

Abstract

In this paper, a numerical simulation-based parametric study on wire bonding is implemented by the probability method that combines the response surface strategy and the Monte Carlo random simulation method. The distribution probabilities of the peak stress values in metal and interlayer dielectric (ILD) stack layers are discussed with the variation of free air ball radius, Al pad thickness and ball bonding height in the wire bonding structure and the sensitivities of the output performances to the input variables are assessed. Finally, the major impact factors are determined for optimization of wire bonding.