{"title":"Memory repair logic sharing techniques and their impact on yield","authors":"B. Nadeau-Dostie, L. Romain","doi":"10.1109/ITC44778.2020.9325280","DOIUrl":null,"url":null,"abstract":"Techniques for sharing memory repair logic amongst memories are described. The techniques allows reducing silicon area and loading time of repair information upon power up. The impact on yield is predicted using two different methods based on defect density and clustering or past silicon experience.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Test Conference (ITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITC44778.2020.9325280","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Techniques for sharing memory repair logic amongst memories are described. The techniques allows reducing silicon area and loading time of repair information upon power up. The impact on yield is predicted using two different methods based on defect density and clustering or past silicon experience.