Pool boiling heat transfer enhancement by surface modification/micro-structures for electronics cooling: a review

Abstract

Electronics cooling is an important aspect of the microelectronics and microsystem packaging. Liquid cooling involving boiling is emerging as main technique for high heat flux application. Primary issues related to boiling are wall temperature over shoot at boiling incipience and critical heat flux. Heat transfer enhancement has concerned the researchers and practitioners for many decades. This paper reviews experimental works done for boiling enhancement by surface modification and micro-machined structures. Boiling incipient temperature and critical heat flux by various techniques are analyzed. Aim of this review is to design a novel micro-machined structure to enhance boiling and integration of the structure with the chip for cooling 3D stacked module.