A capacitance method to determine the metallurgical gate-to-source/drain overlap length of submicron LDD MOSFETs

M. Jo, Jin-Hyoung Kim, Sung-Ki Kim, H. Yoon, Dai-Hoon Lee
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引用次数: 3

Abstract

A new CV method is proposed to determine the metallurgical gate-to-source/drain overlap length of LDD MOSFETs. In addition, the flatband voltage is extracted roughly by using the same method. The gate-to-substrate capacitances of a plate gate capacitor and finger type capacitor with the same total gate areas are measured with varying gate bias. At the peak point of difference between the two capacitor data, overlap length is extracted using a simple formula. This method is evaluated using the two-dimensional device simulator.
一种确定亚微米LDD mosfet的冶金栅源极/漏极重叠长度的电容方法
提出了一种新的CV法来确定LDD mosfet的冶金栅源极/漏极重叠长度。此外,采用相同的方法对平带电压进行了粗略提取。用不同的栅极偏压测量了具有相同栅极总面积的板栅电容和指型电容的栅极到衬底电容。在两个电容数据差值的峰值处,用一个简单的公式提取重叠长度。使用二维设备模拟器对该方法进行了评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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