Reliability and risk assessment from accelerated test result and field modeling: Delamination issue case study for automotive analog parts and sensors

Abstract

For risk assessments in automotive semiconductor industry, while a typical field modeling uses failure mileages, a new time-based approach was implemented for a delamination issue on analog and sensor products. It highlighted a bimodality coherent with the failure analysis conclusions and with the two phases in the product life. Modeling per impacted wafer allowed to reveal specific profiles for some wafers. Modeling on Reliability Temperature Humidity Bias (THB) test results was also performed and compared to the field modeling.