CDM failure modes in a 130nm ASIC technology

C. Brennan, J. Sloan, D. Picozzi
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引用次数: 25

Abstract

CDM failures in I/O cells in a 130 nm CMOS ASIC technology are studied. Most failures occurred in internal circuits that were not connected to chip pads. The failures correlate to the I/O power supply network resistance at the I/O cells. Failure modes include gate oxide ruptures on internal nodes driven by active circuits.
130nm ASIC技术中的CDM失效模式
研究了130nm CMOS ASIC工艺中I/O电池的CDM失效。大多数故障发生在没有连接到芯片衬垫的内部电路中。故障与I/O单元的I/O电源网络电阻有关。失效模式包括由有源电路驱动的内部节点栅氧化物断裂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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