The effect of plasma-induced oxide and interface degradation on hot carrier reliability

Abstract

A simple method is proposed to quantitatively evaluate hot carrier reliability of a plasma-stressed PMOSFET using its characteristic degradation measured before forming gas annealing. This method is used to deduce a plasma-stress equivalent charging current. This plasma current increases with a decrease in gate oxide thickness. The hot carrier reliability of thinner oxides, however, is less influenced. Superior immunity of reoxidized-nitrided-oxide to hot carrier degradation after plasma stress is also demonstrated.<>