{"title":"Software-based development of 3D integration flows","authors":"A. Grunewald, K. Hahn, R. Bruck","doi":"10.1109/IEMT.2012.6521773","DOIUrl":null,"url":null,"abstract":"In recent years 3D IC design and manufacturing is continuously emerging. Along with the variety of possibilities on how to vertically integrate two or more dies, many aspects including cost, design and choice of technology must be considered. Therefore a design methodology and software implementation is presented in this paper which makes use of the mutual dependency of design and process technology in order to provide a manufacturable integration flow.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521773","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
In recent years 3D IC design and manufacturing is continuously emerging. Along with the variety of possibilities on how to vertically integrate two or more dies, many aspects including cost, design and choice of technology must be considered. Therefore a design methodology and software implementation is presented in this paper which makes use of the mutual dependency of design and process technology in order to provide a manufacturable integration flow.