Thermal performance of a double-action pulsed jet CPU cooler

T. Chandratilleke, Dibakar Rakshit
{"title":"Thermal performance of a double-action pulsed jet CPU cooler","authors":"T. Chandratilleke, Dibakar Rakshit","doi":"10.1109/EPTC.2013.6745741","DOIUrl":null,"url":null,"abstract":"More efficient and compact thermal management techniques are critical for the development of Central Processing Units (CPU) embedded in complex and powerful modern computer systems. Introducing a technological alternative to conventional fan-cooled systems, this paper presents an experimental investigation of a double-action CPU cooler based on the pulsed (or synthetic) jet principle. The study develops a prototype of this new CPU cooler and tests it for a range of operating conditions to ascertain its cooling capabilities. The performance of this device is compared with a conventional fan CPU heat sink design for evaluating the relative thermal advantages of the new configuration. It is observed that the pulsed-jet CPU cooler achieves about 1.5 times more heat removal rate than a comparable fan CPU cooler. Whilst thermal optimisation is feasible, it is recognised that this pulsed jet arrangement has unique surface cooling ability without additional fluid circuits, making it particularly desirable for high-capacity electronic cooling applications.","PeriodicalId":210691,"journal":{"name":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2013.6745741","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

More efficient and compact thermal management techniques are critical for the development of Central Processing Units (CPU) embedded in complex and powerful modern computer systems. Introducing a technological alternative to conventional fan-cooled systems, this paper presents an experimental investigation of a double-action CPU cooler based on the pulsed (or synthetic) jet principle. The study develops a prototype of this new CPU cooler and tests it for a range of operating conditions to ascertain its cooling capabilities. The performance of this device is compared with a conventional fan CPU heat sink design for evaluating the relative thermal advantages of the new configuration. It is observed that the pulsed-jet CPU cooler achieves about 1.5 times more heat removal rate than a comparable fan CPU cooler. Whilst thermal optimisation is feasible, it is recognised that this pulsed jet arrangement has unique surface cooling ability without additional fluid circuits, making it particularly desirable for high-capacity electronic cooling applications.
双作用脉冲射流CPU冷却器的热性能
更高效和紧凑的热管理技术对于嵌入式复杂和强大的现代计算机系统中的中央处理器(CPU)的发展至关重要。介绍了一种替代传统风扇冷却系统的技术,本文提出了一种基于脉冲(或合成)射流原理的双作用CPU冷却器的实验研究。该研究开发了这种新型CPU冷却器的原型,并对其进行了一系列操作条件的测试,以确定其冷却能力。将该器件的性能与传统风扇CPU散热器设计进行比较,以评估新配置的相对散热优势。结果表明,脉冲射流CPU冷却器的散热效率是同类风扇CPU冷却器的1.5倍。虽然热优化是可行的,但人们认识到,这种脉冲射流布置具有独特的表面冷却能力,无需额外的流体回路,使其特别适合高容量电子冷却应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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