Micro-mechanical characterizations of solder mask materials

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) Pub Date : 2000-12-05 DOI:10.1109/EPTC.2000.906364

Hau Zhu, Yifan Guo, Wen-Ying Li, A. Tseng, B. Martin

{"title":"Micro-mechanical characterizations of solder mask materials","authors":"Hau Zhu, Yifan Guo, Wen-Ying Li, A. Tseng, B. Martin","doi":"10.1109/EPTC.2000.906364","DOIUrl":null,"url":null,"abstract":"The mechanical properties of solder masks are critical in the reliability performance of flip-chip packages. Many recent studies show that the mechanical properties of solder mask materials have great influence on moisture absorption, delamination at interconnections and solder fatigue life in flip-chip packages. There are also assembly process issues related to the properties of solder masks. This article presents an experimental investigation that mechanically characterizes two polyimide solder mask materials, type A and type B, by using a micro thermo-mechanical tester. The mask samples are prepared as thin film specimens. Mechanical properties such as Young's modulus, failure strength and creep behaviors are determined based on the recorded data from the experiments. In addition, a testing procedure for measuring the coefficient of thermal expansion (CTE) is developed, which provides an alternative to the TMA method. It is shown that the experimental investigation is suitable in conducting such a characterization of thin-film solder masks.","PeriodicalId":430941,"journal":{"name":"Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2000.906364","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 14

Abstract

The mechanical properties of solder masks are critical in the reliability performance of flip-chip packages. Many recent studies show that the mechanical properties of solder mask materials have great influence on moisture absorption, delamination at interconnections and solder fatigue life in flip-chip packages. There are also assembly process issues related to the properties of solder masks. This article presents an experimental investigation that mechanically characterizes two polyimide solder mask materials, type A and type B, by using a micro thermo-mechanical tester. The mask samples are prepared as thin film specimens. Mechanical properties such as Young's modulus, failure strength and creep behaviors are determined based on the recorded data from the experiments. In addition, a testing procedure for measuring the coefficient of thermal expansion (CTE) is developed, which provides an alternative to the TMA method. It is shown that the experimental investigation is suitable in conducting such a characterization of thin-film solder masks.

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阻焊材料的微观力学特性

阻焊膜的机械性能对倒装封装的可靠性性能至关重要。近年来的许多研究表明，阻焊材料的力学性能对倒装封装中的吸湿性、互连层脱层和焊料疲劳寿命有很大影响。还有与焊掩膜性能相关的组装工艺问题。本文介绍了利用微型热机械测试仪对A型和B型两种聚酰亚胺阻焊材料进行机械表征的实验研究。掩膜样品制备成薄膜样品。力学性能如杨氏模量、破坏强度和蠕变行为是根据实验记录的数据确定的。此外，还开发了一种测量热膨胀系数(CTE)的测试程序，为TMA方法提供了一种替代方法。结果表明，该实验研究适合于对薄膜焊掩膜进行表征。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)

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