Extremely low power c-axis aligned crystalline In-Ga-Zn-O 60 nm transistor integrated with industry 65 nm Si MOSFET for IoT normally-off CPU application
Shao Hui Wu, X. Y. Jia, Mei Kui, C. Shuai, Tien-Yu Hsieh, H. Lin, Derek Chen, Chen Bin Lin, J. Y. Wu, T. Yew, Yuta Endo, K. Kato, S. Yamazaki
{"title":"Extremely low power c-axis aligned crystalline In-Ga-Zn-O 60 nm transistor integrated with industry 65 nm Si MOSFET for IoT normally-off CPU application","authors":"Shao Hui Wu, X. Y. Jia, Mei Kui, C. Shuai, Tien-Yu Hsieh, H. Lin, Derek Chen, Chen Bin Lin, J. Y. Wu, T. Yew, Yuta Endo, K. Kato, S. Yamazaki","doi":"10.1109/VLSIT.2016.7573378","DOIUrl":null,"url":null,"abstract":"For the first time, laboratory 60 nm c-axis aligned crystalline In-Ga-Zn-O (CAAC-IGZO) oxide semiconductor FET (OSFET) was successfully integrated with industrial 65 nm Si MOSFET (SiFET). By this hybrid process, OSFET with extremely low off-state leakage level ~zA (1×10-21A) was fabricated, while traditional Si device can only reach 1×10-12A leakage level. For IoT (Internet of Things) applications, normally-off CPU (Noff CPU) fabricated by this hybrid process achieved 86% reduction of power consumption. The hybrid process can be extended to other applications like eDRAM, image sensor and FPGA.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2016.7573378","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
For the first time, laboratory 60 nm c-axis aligned crystalline In-Ga-Zn-O (CAAC-IGZO) oxide semiconductor FET (OSFET) was successfully integrated with industrial 65 nm Si MOSFET (SiFET). By this hybrid process, OSFET with extremely low off-state leakage level ~zA (1×10-21A) was fabricated, while traditional Si device can only reach 1×10-12A leakage level. For IoT (Internet of Things) applications, normally-off CPU (Noff CPU) fabricated by this hybrid process achieved 86% reduction of power consumption. The hybrid process can be extended to other applications like eDRAM, image sensor and FPGA.