Issues Regarding New Product Release in Semiconductor Manufacturing

Abstract

There are varied levels of communication among the multiple development groups involved in releasing a new product. As the product creation flow is traversed, groups may make assumptions and sometimes little "cut corners" that are assumed to be handled by another operation. Unfortunately, the last wall over which the chip is thrown is at manufacturing. It is here where the fight, fix and payment for all those loose ends and obscure assumptions are made. With this in mind, the presentation delivers some practical issues to take into consideration when releasing new products or new equipment to semiconductor manufacturing.