Optimization and scaling limit forecast of nitrided gate oxide using an equivalent nitride/oxide (N/O) stack model

V. Chang, C. Chen, Y. Jin, C. Chen, T. Lee, S. Chen, M. Liang
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引用次数: 2

Abstract

A semi-empirical model was developed to calculate the equivalent oxide thickness (EOT) and leakage current of nitrided gate oxide by hypothetically dividing the nitrided oxide into a nitride/oxide (N/O) stack. The calculations agree well with the experimental data (R/sup 2/ > 0.99) for various nitrided oxides with EOT ranging from 12 to 23 /spl Aring/. A model-based strategy for the optimization of nitrided oxide is presented and demonstrated by a nitrided oxide sample which meets both the EOT and leakage current requirements of ITRS 65-nm low standby power (LSTP) technology and shows no electron mobility degradation. The model forecasts that a nitrogen concentration of 20% approximately the maximum from Oxide nitridation processes - satisfies the ITRS requirements for production until Year 2007. The production afterwards will require alternative dielectrics such as N/O stack or high-k materials for greater leakage current reductions.
基于等效氮化物/氧化物(N/O)堆模型的氮化栅极氧化物优化及结垢极限预测
建立了一种半经验模型,通过假设将氮化栅极氧化物划分为氮化物/氧化物(N/O)堆,计算了等效氧化物厚度(EOT)和漏电流。计算结果与实验数据吻合较好(R/sup 2/ > 0.99), EOT范围为12 ~ 23 /spl /。提出了一种基于模型的氮化氧化物优化策略,并通过氮化氧化物样品进行了验证,该氮化氧化物样品既满足ITRS 65纳米低待机功率(LSTP)技术的EOT要求,又满足漏电流要求,且没有电子迁移率下降。该模型预测,20%的氮浓度(约为氧化物氮化过程的最大值)可以满足ITRS到2007年的生产要求。之后的生产将需要替代介质,如N/O堆叠或高k材料,以更大程度地降低泄漏电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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