Densification of Carbon Nanotube Bundles for Interconnect Application

Abstract

We demonstrated a post-growth processing method to increase the site density of carbon nanotube (CNT) bundles, a critical step towards CNT interconnect for use in future ICs. CVD-grown CNT bundles are immersed in an organic solvent, then withdrawn from the liquid bath by solvent evaporation, and consequently compacted. The CNT site density is increased 5~25 times. Influences of bundle structure parameters on densification are discussed and the interconnect implementation of densified CNTs is presented.