SI and EMI analysis of analog circuit board combination of PEEC and MOR

N. Matsui, D. Divekar, N. Orhanovic
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Abstract

A method for analyzing SI and EMI of an analog circuit board considering the effect of analog patterns has been proposed. This method uses the combination of PEEC (partial element equivalent circuit) and MOR (model order reduction). Major contributors to signal, power and EMI noise in high power supply circuits are the parasitics of arbitrary shape conductor patterns between discrete components such as power MOS transistors and passive components. The conductor patterns are modeled as meshed RLGC network circuits, and then compressed into a compact circuit model. Voltage and current waveforms in the time domain and EMI in the frequency domain are simulated by using the obtained macro model and nonlinear devices.
模拟电路板组合PEEC和MOR的SI和EMI分析
提出了一种考虑模拟模式影响的模拟电路板SI和EMI分析方法。该方法采用了部分元件等效电路(PEEC)和模型阶数约简(MOR)相结合的方法。高电源电路中产生信号、功率和电磁干扰噪声的主要原因是在分立元件(如功率MOS晶体管和无源元件)之间的任意形状导体模式的寄生。导线模式建模为网格化RLGC网络电路,然后压缩成一个紧凑的电路模型。利用所得到的宏观模型和非线性器件对时域电压、电流波形和频域电磁干扰进行了仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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