EMI and power delivery design in PC systems

Abstract

This paper addresses the relationship of power transient design with the EMI characteristics of high-performance microprocessors. After a brief review of EMI and its role in modern PC systems, a modeling approach for a complete CPGA package is discussed. The model includes on-chip and on-package decoupling capacitors, multiple power and ground planes for core voltages, C4 bumps, inter-planar vias, and pins. Equivalent SPICE circuit for the chip-package combination is obtained and the results for power transients and frequency domain transfer characteristics are given.