H. Teo, Shuting Chen, Lei Zhu, Y. Hua, Z. X. Yuan, Y. S. Heng, Chao Yong Li
{"title":"Failure analysis on ultra-low k film de-lamination by TOF-SIMS composition analysis","authors":"H. Teo, Shuting Chen, Lei Zhu, Y. Hua, Z. X. Yuan, Y. S. Heng, Chao Yong Li","doi":"10.1109/IPFA.2012.6306292","DOIUrl":null,"url":null,"abstract":"A failure case study and root cause of ultra low-k film delamination was reported. TOF-SIMS composition analysis found higher concentration of carbon at the transition oxide. The clogging of the foreline flow path was identified in the process to cause the transient carbon surge, resulting in higher carbon concentration in the transition oxide and poor adhesion of the ultra low-k film.","PeriodicalId":267457,"journal":{"name":"2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"414 2-3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2012.6306292","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A failure case study and root cause of ultra low-k film delamination was reported. TOF-SIMS composition analysis found higher concentration of carbon at the transition oxide. The clogging of the foreline flow path was identified in the process to cause the transient carbon surge, resulting in higher carbon concentration in the transition oxide and poor adhesion of the ultra low-k film.