Effect of humidity cycling on reliability of overlaid high density interconnects

Abstract

The authors present a finite element simulation, performed to observe the stresses generated in a typical high-density interconnect structure as a result of swelling mismatches due to water absorption. They focus on stresses which could cause de-adhesion and microbuckling of dielectric films due to humidity cycling. Numerical analysis was used to examine the potential failure sites, modes, and failure mechanisms.<>