{"title":"Power-on contention: a reliability issue for logic devices","authors":"R. Muniandy, S. Miller, Lim Yew Tee, R. Boylan","doi":"10.1109/IPFA.1995.487589","DOIUrl":null,"url":null,"abstract":"Power-on contention has emerged as a new reliability concern for logic devices. A description of what power-on contention is, the reliability risk it poses (especially with shrinking device geometry) and the need to design away from this phenomenon, is given. A case study of real failure due to power-on contention will make up a large part of this presentation.","PeriodicalId":216880,"journal":{"name":"Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"277 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.1995.487589","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Power-on contention has emerged as a new reliability concern for logic devices. A description of what power-on contention is, the reliability risk it poses (especially with shrinking device geometry) and the need to design away from this phenomenon, is given. A case study of real failure due to power-on contention will make up a large part of this presentation.