Y. Kim, S. Youn, W. Han, Y. Cho, H. Park, B. Chang, Y. Oh
{"title":"Three-dimensional microstructures fabricated by multi-step electrochemical etching of aluminum sheet","authors":"Y. Kim, S. Youn, W. Han, Y. Cho, H. Park, B. Chang, Y. Oh","doi":"10.1109/SENSOR.2009.5285941","DOIUrl":null,"url":null,"abstract":"We present a fabrication process for three-dimensional (3D) microstructures using multi-step electrochemical etching of metal foils. The present process offers advantages of simple, cose-effective, and fast process with uniform and well-controlled material property. In the experimental study, we performed single-step electrochemical etching of 2D cantilever array and multi-step electrochemical etching of 3D micro probe array. The average depth etch rate and the average bias etch rate were measured as 1.50±0.10µm/min, and 0.77±0.03 µm wide structure. The surface roughness of 11.34nm has been measured. The demonstrated multi-step electrochemical etching process results in a simple, cost-effective, and timesaving fabrication of 3D metallic structures.","PeriodicalId":247826,"journal":{"name":"TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2009.5285941","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We present a fabrication process for three-dimensional (3D) microstructures using multi-step electrochemical etching of metal foils. The present process offers advantages of simple, cose-effective, and fast process with uniform and well-controlled material property. In the experimental study, we performed single-step electrochemical etching of 2D cantilever array and multi-step electrochemical etching of 3D micro probe array. The average depth etch rate and the average bias etch rate were measured as 1.50±0.10µm/min, and 0.77±0.03 µm wide structure. The surface roughness of 11.34nm has been measured. The demonstrated multi-step electrochemical etching process results in a simple, cost-effective, and timesaving fabrication of 3D metallic structures.