Three-dimensional microstructures fabricated by multi-step electrochemical etching of aluminum sheet

Y. Kim, S. Youn, W. Han, Y. Cho, H. Park, B. Chang, Y. Oh
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引用次数: 0

Abstract

We present a fabrication process for three-dimensional (3D) microstructures using multi-step electrochemical etching of metal foils. The present process offers advantages of simple, cose-effective, and fast process with uniform and well-controlled material property. In the experimental study, we performed single-step electrochemical etching of 2D cantilever array and multi-step electrochemical etching of 3D micro probe array. The average depth etch rate and the average bias etch rate were measured as 1.50±0.10µm/min, and 0.77±0.03 µm wide structure. The surface roughness of 11.34nm has been measured. The demonstrated multi-step electrochemical etching process results in a simple, cost-effective, and timesaving fabrication of 3D metallic structures.
采用多步电化学刻蚀法制备铝板三维微结构
我们提出了一种利用多步电化学蚀刻金属箔的三维微结构制造工艺。该工艺具有简单、高效、快速、材料性能均匀、控制好等优点。在实验研究中,我们进行了二维悬臂阵列的单步电化学刻蚀和三维微探针阵列的多步电化学刻蚀。平均深度刻蚀率为1.50±0.10µm/min,平均偏置刻蚀率为0.77±0.03µm。测得表面粗糙度为11.34nm。所演示的多步骤电化学蚀刻工艺可以简单、经济、省时地制造3D金属结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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