Measurement and field simulation based characterization of plastic IC packages

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634066

F. Mernyei

引用次数: 7

Abstract

A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.

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基于塑料IC封装特性的测量和现场仿真

介绍了一种获取集成电路封装电气模型的方法。我们使用测量的s参数来提取封装和周围组件的等效电路。通过三维现场仿真验证了等效电路的正确性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electrical Performance of Electronic Packaging

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