New Locos Trench Oxide IGBT Enables 25% Higher Current Density in 4.5kV/1500A Module

L. Ngwendson, I. Deviny, C. Zhu, I. Saddiqui, J. Hutchings, C. Kong, Y. Wang, H. Luo
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引用次数: 4

Abstract

In this paper we present first results of a 4.5kV/1500A IGBT module using new LOCOS (Local Oxidation of Silicon) Trench Oxide IGBTs (LTO-IGBT). It is shown that this new module with increased current density compared to the previous DMOS generation, also show very robust dynamic and competitive performance at $\mathbf{T}_{\mathbf{J}}=150^{0}\mathbf{C}$.
新型Locos沟槽氧化物IGBT在4.5kV/1500A模块中使电流密度提高25%
在本文中,我们介绍了使用新型LOCOS(硅局部氧化)沟槽氧化IGBT (LTO-IGBT)的4.5kV/1500A IGBT模块的第一个结果。结果表明,在$\mathbf{T}_{\mathbf{J}}=150^{0}\mathbf{C}$时,该模块具有较前一代DMOS更高的电流密度,具有非常强的动态性能和竞争力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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