High performance and low variability fully-depleted strained-SOI MOSFETs

J. Mazurier, O. Weber, F. Andrieu, F. Allain, C. Tabone, A. Toffoli, C. Fenouillet-Béranger, L. Brevard, L. Tosti, P. Perreau, M. Belleville, O. Faynot
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引用次数: 6

Abstract

In this paper, we demonstrate high performance Fully Depleted Silicon-On-Insulator CMOS on 300mm strained SOI (sSOI) wafers. Up to 100% drive current (ION) enhancement is demonstrated by sSOI nMOSFETs vs. unstrained SOI at W=80nm active width and L=45nm gate length. These devices indeed yield 1200µA/µm ION at IOFF=10−8 A/µm and VD=0.9V supply voltage. At the same time, they highlight the same excellent VT variability as the transistors on unstrained SOI. Optimizations of extensions and source/drain implants have been realized on both n&pMOS in order to boost further this trade-off between performance and variability thanks to electrostatic improvements.
高性能和低可变性全耗尽应变soi mosfet
在本文中,我们展示了在300mm应变SOI (sSOI)晶圆上的高性能全耗尽绝缘体上硅CMOS。在W=80nm有源宽度和L=45nm栅极长度下,sSOI nmosfet与未应变的SOI相比,高达100%的驱动电流(ION)增强。这些器件确实在IOFF=10−8 A/µm和VD=0.9V电源电压下产生1200µA/µm离子。同时,它们突出了与非应变SOI上晶体管相同的优异VT可变性。在n&pMOS上都实现了扩展和源/漏植入物的优化,以进一步提高性能和可变性之间的权衡,这要归功于静电的改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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