The cost study of 300mm through silicon interposer (TSI) with BEOL interconnect

Abstract

The cost is always an important parameter for the new technical application. Through Si Via (TSV) technology becomes hot topic since image sensor application. We setup cost model according to our process flow and throughput for the cost study and reduction of 300mm TSI interposer. High cost area was calculated through the cost model. Full TSI process flow was separated as TSV, BEOL, Top UBM, TDDB, BSR, BS RDL& Bump sub-process flow. Top three high cost sub-process flow for 2.5D TSI with BEOL interconnect were identified from TSI process flow. Top three processes modules were isolated for each high cost subprocess flow. The high cost process modules were analyzed and explained in the paper. Two approaches were proposed for the cost reduction base on cost model analysis.