Mechanical properties of SiCOH film related to CPI and High Load Indentation test of real Cu/Low-k structure with bumps

Abstract

Relation between mechanical properties of SiCOH film and white bump failures has been investigated. Among these mechanical properties, the fracture toughness of SiCOH film was related to the white bump failures. In addition, to simplify the complex Chip Package Interaction (CPI) tests, we proposed High Load Indentation (HiLI) test as a novel measurement of toughness for a real structure of multilayer Cu/Low-k interconnects with Pb-free bump. We found that the critical load by HiLI test is related to white bump failure.