A study in establishing flip-chip ball grid array (FCBGA) second level interconnect (SLI) reliability requirement by CFD simulation

Abstract

CFD simulation using commercial tool such as Flotherm has been carried out to analyze the solder ball temperature (Tsb) in different regions underneath a FCBGA package in order to establish and characterize the second level interconnect (SLI) reliability requirement of the package. The package details and the mechanical load on the package directly affect Tsb and the thermal fatigue locus. The Tsb is used to correlate with the modified Coffin-Manson model in order to assess the package SLI solder joint reliability performance under temperature cycling stress.