Through mold interconnects for fan-out wafer level package

Abstract

Through mold interconnects (TMI) is a key enabler for fan-out wafer level packaging (FOWLP) for 3D integration. Three different types of TMI have been developed for both mold-first and RDL-first fabrication flow. The three types of TMI consist of laser drilled vias, vertical wire-bonds and Cu pillars interconnect. The process flow and fabrication results of each TMI will be presented in this paper.